Intel, Samsung, TSMC Reach Agreement for 450mm Wafer Manufacturing Transition May 06, 2008 | User rating: 3.7 / 5 after 9 vote(s)
| User comments: 1
Intel Corp., Samsung Electronics and TSMC today announced they have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012. The transition to larger ... | |
 Silent, microchip-sized 'fan' has no moving parts, yet produces enough wind to cool a laptop March 18, 2008 | User rating: 4.5 / 5 after 109 vote(s)
| User comments: 11
Engineers harnessing the same physical property that drives silent household air purifiers have created a miniaturized device that is now ready for testing as a silent, ultra-thin, low-power and low maintenance ... | |
Holland's ASML warns of lower sales for chip equipment April 16, 2008 | User rating: not shown ( 2 vote(s) ) | No comments yet
Dutch computer chip equipment maker ASML warned Wednesday that sales this year could be down 10 percent after a weaker performance in the first quarter. | |
Hynix reports Q1 loss on global memory chip glut April 25, 2008 | User rating: not rated yet | No comments yet
South Korea's Hynix Semiconductor, the world's number two maker of computer memory chips, said Friday it posted a net loss in the first quarter because a global glut of memory chips drove down prices. | |
 IBM researchers unveil green optical network technology prototype February 28, 2008 | User rating: 4.6 / 5 after 79 vote(s)
| User comments: 1
IBM researchers today unveiled the fastest and most highly integrated optical data bus ever developed. The prototype technology could bring massive amounts of bandwidth in an energy-efficient way to all kinds ... | |
The future of computing -- carbon nanotubes and superconductors to replace the silicon chip March 28, 2008 | User rating: 4.1 / 5 after 12 vote(s)
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The future of computing is under the spotlight at the Institute of Physics’ Condensed Matter and Materials Physics conference at the Royal Holloway College of the University of London on 26-28 March. | |
 IBM Extends Moore's Law to the Third Dimension April 12, 2007 | User rating: 4.7 / 5 after 175 vote(s)
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IBM today announced a breakthrough chip-stacking technology in a manufacturing environment that paves the way for three-dimensional chips that will extend Moore’s Law beyond its expected limits. The technology ... | |
 IBM Reveals Breakthrough eDRAM Memory Technology February 14, 2007 | User rating: 4.5 / 5 after 66 vote(s)
| No comments yet
In papers presented at the International Solid State Circuits Conference, IBM revealed a first-of-its-kind, on-chip memory technology that features the fastest access times ever recorded in eDRAM (Embedded ... | |
 IBM Alliances Announce Advancement in High-K/Metal Gate Technology December 14, 2007 | User rating: 4.6 / 5 after 33 vote(s)
| No comments yet
IBM and its joint development partners -- AMD, Chartered Semiconductor Manufacturing, Freescale, Infineon, and Samsung -- announced an innovative approach to speed the implementation of a breakthrough material ... | |
 Flexible electronics advance boosts performance, manufacturing December 13, 2006 | User rating: 3.5 / 5 after 20 vote(s)
| No comments yet
Flexible electronics made with organic, or carbon-based, transistors could enable technologies such as low-cost sensors on product packaging and ''electronic paper'' displays as thin and floppy as a placemat. ... | |
AMD, Partners Produce Test Chip Using EUV Lithography February 26, 2008 | User rating: 4.3 / 5 after 21 vote(s)
| User comments: 3
AMD, working together with its research partner, IBM, announced it has produced a working test chip utilizing Extreme Ultra-Violet (EUV) lithography for the critical first layer of metal connections across the entire chip. ... | |
 Epson, E Ink Develop Breakthrough Controller IC for Electronic Paper Displays April 16, 2008 | User rating: not shown ( 2 vote(s) ) | No comments yet
Seiko Epson and E Ink today announced a jointly developed display controller IC enabling new capabilities for E Ink's Vizplex enabled electronic paper displays. EPD low-power consumption screen technology ... | |
 SSRL Aids Development of Plastic Electronics May 04, 2006 | User rating: 4.3 / 5 after 6 vote(s)
| No comments yet
For close to a decade, researchers have been trying to improve the performance of plastic semiconductors to the level of amorphous silicon—the semiconductor used in low-cost electronics such as photovoltaic ... | |
 Breaking the performance barrier of 22-nm CMOS technology February 19, 2008 | User rating: 4.5 / 5 after 23 vote(s)
| User comments: 1
A major initiative has been launched in Europe with a top-ranked project called DUALLOGIC, Dual channel CMOS for (sub)-22 nm high performance logic. | |
Intel, STMicroelectronics Deliver Industry's First Phase Change Memory Prototypes February 06, 2008 | User rating: 4.3 / 5 after 20 vote(s)
| User comments: 1
Intel Corporation and STMicroelectronics reached a key industry milestone today as they began shipping prototype samples of a future product using a new, innovative memory technology called Phase Change Memory (PCM). The ... | |
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