Intel, STMicroelectronics Deliver Industry's First Phase Change Memory Prototypes February 06, 2008 | User rating: 4.3 / 5 after 20 vote(s)
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Intel Corporation and STMicroelectronics reached a key industry milestone today as they began shipping prototype samples of a future product using a new, innovative memory technology called Phase Change Memory (PCM). The ... | |
 Researchers find a crucial difficulty in semiconductor device scaling September 06, 2007 | User rating: 4.3 / 5 after 16 vote(s)
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In 1959, Nobel Prize winner Richard Feynman presented a talk entitled "There's Plenty of Room at the Bottom." Feynman concluded that there was no physical reason why humans couldn't manipulate atoms. However, ... | |
 Samsung Says 3D Silicon Will Drive Boundless Industry Growth in Unprecedented Era of Fusion Technology December 13, 2006 | User rating: 3.3 / 5 after 33 vote(s)
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Samsung Electronics today shared stunning prospects for a new industry-fusing technology era that will offer tremendous global opportunities for expanded use of three-dimensional (3D) silicon-based technologies. ... | |
AMD, Partners Produce Test Chip Using EUV Lithography February 26, 2008 | User rating: 4.3 / 5 after 21 vote(s)
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AMD, working together with its research partner, IBM, announced it has produced a working test chip utilizing Extreme Ultra-Violet (EUV) lithography for the critical first layer of metal connections across the entire chip. ... | |
HP Unveils Revolutionary Wireless Chip that Links the Digital and Physical Worlds July 17, 2006 | User rating: 3.3 / 5 after 26 vote(s)
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HP today announced that its researchers have developed a miniature wireless data chip that could provide broad access to digital content in the physical world. | |
 Researchers Extend Life of Hot Temperature Electronic Chip September 11, 2007 | User rating: 4.5 / 5 after 25 vote(s)
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NASA researchers have designed and built a new circuit chip that can take the heat like never before. | |
 Breaking the performance barrier of 22-nm CMOS technology February 19, 2008 | User rating: 4.3 / 5 after 27 vote(s)
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A major initiative has been launched in Europe with a top-ranked project called DUALLOGIC, Dual channel CMOS for (sub)-22 nm high performance logic. | |
 IBM Pioneers Process to Turn Waste into Solar Energy October 30, 2007 | User rating: 4.7 / 5 after 21 vote(s)
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IBM today announced an innovative new semiconductor wafer reclamation process pioneered at its Burlington, Vermont manufacturing facility. The new process uses a specialized pattern removal technique to repurpose ... | |
New computer program automates chip debugging November 02, 2007 | User rating: 4.9 / 5 after 15 vote(s)
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Fixing design bugs and wrong wire connections in computer chips after they've been fabricated in silicon is a tedious, trial-and-error process that often costs companies millions of dollars and months of time-to-market. | |
 Toshiba Develops New NAND Flash Technology June 12, 2007 | User rating: 4.7 / 5 after 14 vote(s)
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Toshiba Corporation today announced a new three dimensional memory cell array structure that enhances cell density and data capacity without relying on advances in process technology, and with minimal increase ... | |
 Researchers achieve atomic spectroscopy on a chip June 01, 2007 | User rating: 4.5 / 5 after 10 vote(s)
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Researchers at the University of California, Santa Cruz, have performed atomic spectroscopy with integrated optics on a chip for the first time, guiding a beam of light through a rubidium vapor cell integrated ... | |
First Details on a Future Intel Design Codenamed 'Larrabee' August 04, 2008 | User rating: 3.4 / 5 after 5 vote(s)
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Intel Corporation is presenting a paper at the SIGGRAPH 2008 industry conference in Los Angeles on Aug. 12 that describes features and capabilities of its first-ever forthcoming "many-core" blueprint or architecture codenamed ... | |
 IMEC reports 40 microwatt from micromachined piezoelectric energy harvester June 21, 2007 | User rating: 4.5 / 5 after 12 vote(s)
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IMEC has fabricated an energy harvester to generate energy from mechanical vibrations by using micromachining technology. The harvester comes together with a model which can be used to optimize the device ... | |
The future of computing -- carbon nanotubes and superconductors to replace the silicon chip March 28, 2008 | User rating: 4.1 / 5 after 12 vote(s)
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The future of computing is under the spotlight at the Institute of Physics’ Condensed Matter and Materials Physics conference at the Royal Holloway College of the University of London on 26-28 March. | |
Novel low temperature laser processing of silicon for hybrid organic/inorganic solar cells May 30, 2007 | User rating: 4.2 / 5 after 14 vote(s)
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Researchers at the Advanced Technology Institute (ATI) at the University of Surrey have reported a new technique to UV laser processing of thin film silicon for applications such as display control circuits and solar cells, ... | |
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