 IMEC obtains record conversion efficiency of 24.7% for GaAs solar cells on Ge substrate February 25, 2008 | User rating: not shown ( 2 vote(s) ) | User comments: 1
IMEC has realized a single-junction GaAs solar cell on a Ge substrate with a record conversion efficiency of 24.7%. The efficiency was measured and confirmed by NREL (National Renewable Energy Laboratory, ... | |
NXP announces world's smallest high-performance MOSFET February 25, 2008 | User rating: not shown ( 4 vote(s) ) | No comments yet
NXP Semiconductors, the independent company founded by Philips, today announced a new range of small signal MOSFET devices housed in one of the world’s smallest packages, the SOT883. Boasting an ultra-small 1.0 x 0.6 mm footprint, ... | |
Advanced engineered substrates boost chip performance February 21, 2008 | User rating: not shown ( 2 vote(s) ) | No comments yet
A single platform that combines the benefits of strained silicon and silicon-on-insulator technologies hopes to offer much improved performance for future chip generations. | |
 Breaking the performance barrier of 22-nm CMOS technology February 19, 2008 | User rating: 4.4 / 5 after 25 vote(s)
| User comments: 1
A major initiative has been launched in Europe with a top-ranked project called DUALLOGIC, Dual channel CMOS for (sub)-22 nm high performance logic. | |
SEMATECH Achieves Single Digit EUV Mask Blank Defect Goal February 11, 2008 | User rating: not shown ( 1 vote(s) ) | User comments: 4
Technologists at SEMATECH have successfully demonstrated world-class results in low defect density for mask blanks used in extreme ultraviolet lithography (EUVL)—pushing the technology another significant step toward readiness ... | |
EPIC: Building the Perfect Chip February 07, 2008 | User rating: 4.6 / 5 after 8 vote(s)
| No comments yet
Three years ago a team from Bell Labs took on a very daunting challenge – put an optical networking system on a commercially manufactured silicon chip, load it with a smorgasbord of sophisticated opto-electronic devices in ... | |
 Toshiba develops the world's fastest speed embedded DRAM technology February 06, 2008 | User rating: not shown ( 4 vote(s) ) | No comments yet
Toshiba Corporation today announced that it has realized the world's fastest circuit technology for embedded DRAM for System LSI, achieving a speed of 833MHz at 32Mb density. The technology will be applied ... | |
SanDisk to Launch 43-Nanometer Multi-Level NAND Flash Memory in Mass Production February 06, 2008 | User rating: 4.5 / 5 after 6 vote(s)
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SanDisk Corporation today announced the introduction of Multi-Level (MLC) NAND flash memory using 43 nanometer process technology co-developed with Toshiba Corporation in Japan. | |
 IMEC realized full CMOS multiple antenna receiver for 60 GHz February 06, 2008 | User rating: not shown ( 4 vote(s) ) | No comments yet
At today’s IEEE International Solid State Circuit Conference, IMEC introduced its prototype of a 60GHz multiple antenna receiver, and invites industry to join its 60GHz research program. The 60GHz band offers ... | |
Intel, STMicroelectronics Deliver Industry's First Phase Change Memory Prototypes February 06, 2008 | User rating: 4.3 / 5 after 20 vote(s)
| User comments: 1
Intel Corporation and STMicroelectronics reached a key industry milestone today as they began shipping prototype samples of a future product using a new, innovative memory technology called Phase Change Memory (PCM). The ... | |
Infineon Ships Industry's First CMOS RF Switches with GaAs Performance February 04, 2008 | User rating: not shown ( 3 vote(s) ) | No comments yet
Today Infineon Technologies announced it is shipping in volume the world’s first RF switches that are manufactured in a CMOS-based process on silicon wafers and offer the equivalent performance of RF switches manufactured ... | |
 Copper's not coping: new chips call on light speed January 18, 2008 | User rating: 4.2 / 5 after 32 vote(s)
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The tiny copper wires that connect different areas of an integrated circuit may soon limit microchip-processing speeds. So European researchers have developed technologies to produce and combine semiconductor ... | |
 Measurement innovations add up to big savings for semiconductors January 09, 2008 | User rating: not shown ( 1 vote(s) ) | No comments yet
A new report from the National Institute of Standards and Technology shows that investment in measurement science has and will continue to have a dramatic effect on innovation, productivity, growth and competitiveness ... | |
ASML, Zeiss and Canon Cross-license Lithography Equipment Patent Portfolios December 21, 2007 | User rating: not shown ( 1 vote(s) ) | No comments yet
ASML Holding NV and Carl Zeiss SMT today announce that each has signed an agreement with Canon for the global cross-license of patents in their respective fields of semiconductor lithography and optical components, used to ... | |
 IBM Alliances Announce Advancement in High-K/Metal Gate Technology December 14, 2007 | User rating: 4.6 / 5 after 33 vote(s)
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IBM and its joint development partners -- AMD, Chartered Semiconductor Manufacturing, Freescale, Infineon, and Samsung -- announced an innovative approach to speed the implementation of a breakthrough material ... | |
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