![]() Copper's not coping: new chips call on light speed January 18, 2008 | User rating: 4.2 / 5 after 32 vote(s)
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The tiny copper wires that connect different areas of an integrated circuit may soon limit microchip-processing speeds. So European researchers have developed technologies to produce and combine semiconductor ... | |
![]() Measurement innovations add up to big savings for semiconductors January 09, 2008 | User rating: not shown ( 1 vote(s) ) | No comments yet
A new report from the National Institute of Standards and Technology shows that investment in measurement science has and will continue to have a dramatic effect on innovation, productivity, growth and competitiveness ... | |
ASML, Zeiss and Canon Cross-license Lithography Equipment Patent Portfolios December 21, 2007 | User rating: not shown ( 1 vote(s) ) | No comments yet
ASML Holding NV and Carl Zeiss SMT today announce that each has signed an agreement with Canon for the global cross-license of patents in their respective fields of semiconductor lithography and optical components, used to ... | |
![]() IBM Alliances Announce Advancement in High-K/Metal Gate Technology December 14, 2007 | User rating: 4.6 / 5 after 33 vote(s)
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IBM and its joint development partners -- AMD, Chartered Semiconductor Manufacturing, Freescale, Infineon, and Samsung -- announced an innovative approach to speed the implementation of a breakthrough material ... | |
NEC Develops New Full Low-k Cu-interconnect Structure December 13, 2007 | User rating: not shown ( 2 vote(s) ) | No comments yet
NEC have developed a new Silica-Carbon Composite (SCC) film capable of blocking Cu-atom diffusion into the dielectric films of LSI interconnects. Use of the SCC film establishes an ultimate full-low-k (FLK) Cu interconnect ... | |
Toshiba develops basic technology for world's smallest flash memory element in 10nm generation December 12, 2007 | User rating: 4.5 / 5 after 6 vote(s)
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Toshiba Corporation today announced that it has developed a new double tunneling layer technology applicable to future 10nm generation flash memories. | |
![]() IMEC increases performance of high-k metal gate planar CMOS and FinFETs December 11, 2007 | User rating: not shown ( 3 vote(s) ) | No comments yet
At today’s IEEE International Electron Devices Meeting, IMEC reports significant progress in improving the performance of planar CMOS using hafnium-based high-k dielectrics and tantalum-carbide metal gates ... | |
Cooler, faster, cheaper: Researchers advance process to manufacture silicon chips December 03, 2007 | User rating: 3.3 / 5 after 20 vote(s)
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The next generation of laptops, desk computers, cell phones and other semiconductor devices may get faster and more cost-effective with research from Clemson University. | |
![]() NEC Develops World's Fastest SRAM-Compatible MRAM With Operation Speed of 250MHz November 30, 2007 | User rating: 5 / 5 after 6 vote(s)
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NEC Corporation today announced that it has succeeded in developing a new SRAM-compatible MRAM that can operate at 250MHz, the world's fastest MRAM operation speed. | |
![]() Sandwich technique eases 3D optical chip fabrication November 29, 2007 | User rating: not shown ( 3 vote(s) ) | No comments yet
Complex three-dimensional (3D) integrated circuits involving both optical and electronic elements are now easier to make, thanks to a “wafer bonding” technique developed by a European research consortium. ... | |
![]() Cooking up new MEMS November 29, 2007 | User rating: 4.9 / 5 after 10 vote(s)
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Microelectromechanical systems (MEMS) are tiny components etched from silicon. Production is extremely complex, sometimes with hundreds of steps, each with dozens of parameters. One European project has developed ... | |
![]() Remembering the future November 15, 2007 | User rating: 4.8 / 5 after 12 vote(s)
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As electronics designers cram more and more components onto each chip, current technologies for making random-access memory (RAM) are running out of room. European researchers have a strong position in a new ... | |
Elpida Develops a 65nm-Process 1-Gigabit DDR2 SDRAM, World's Smallest Chip November 07, 2007 | User rating: 4 / 5 after 5 vote(s)
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Elpida Memory, Japan's leading global supplier of Dynamic Random Access Memory (DRAM), announced today that it has completed development of a 1-Gigabit DDR2 SDRAM based on new 65nm process technology. The 65nm process allows ... | |
![]() Toshiba develops new MRAM device which opens the way to giga-bits capacity November 06, 2007 | User rating: 4.5 / 5 after 43 vote(s)
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Toshiba Corporation today announced important breakthroughs in key technologies for magnetoresistive random access memory (MRAM), a promising, next-generation semiconductor memory device. | |
![]() Pushing the limits of chip miniaturisation November 06, 2007 | User rating: 4.4 / 5 after 25 vote(s)
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Over the last four decades, computer chips have found their way into virtually every electronic device in the world. During that time they have become smaller, cheaper and more powerful, but, for a team of ... | |
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