 Pushing the limits of chip miniaturisation November 06, 2007 | User rating: 4.4 / 5 after 25 vote(s)
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Over the last four decades, computer chips have found their way into virtually every electronic device in the world. During that time they have become smaller, cheaper and more powerful, but, for a team of ... | |
New computer program automates chip debugging November 02, 2007 | User rating: 4.9 / 5 after 15 vote(s)
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Fixing design bugs and wrong wire connections in computer chips after they've been fabricated in silicon is a tedious, trial-and-error process that often costs companies millions of dollars and months of time-to-market. | |
 IBM Pioneers Process to Turn Waste into Solar Energy October 30, 2007 | User rating: 4.7 / 5 after 21 vote(s)
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IBM today announced an innovative new semiconductor wafer reclamation process pioneered at its Burlington, Vermont manufacturing facility. The new process uses a specialized pattern removal technique to repurpose ... | |
Intel Demonstrates Industry's First 32nm Chip and Next-Generation Nehalem Microprocessor Architecture September 18, 2007 | User rating: 4.3 / 5 after 26 vote(s)
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Intel Corporation President and CEO Paul Otellini today outlined new products, chip designs and manufacturing technologies that will enable the company to continue its quickened pace of product and technology leadership. | |
 Researchers Extend Life of Hot Temperature Electronic Chip September 11, 2007 | User rating: 4.5 / 5 after 25 vote(s)
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NASA researchers have designed and built a new circuit chip that can take the heat like never before. | |
 Researchers find a crucial difficulty in semiconductor device scaling September 06, 2007 | User rating: 4.3 / 5 after 16 vote(s)
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In 1959, Nobel Prize winner Richard Feynman presented a talk entitled "There's Plenty of Room at the Bottom." Feynman concluded that there was no physical reason why humans couldn't manipulate atoms. However, ... | |
 IMEC reports 40 microwatt from micromachined piezoelectric energy harvester June 21, 2007 | User rating: 4.5 / 5 after 12 vote(s)
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IMEC has fabricated an energy harvester to generate energy from mechanical vibrations by using micromachining technology. The harvester comes together with a model which can be used to optimize the device ... | |
 Toshiba Develops New NAND Flash Technology June 12, 2007 | User rating: 4.7 / 5 after 14 vote(s)
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Toshiba Corporation today announced a new three dimensional memory cell array structure that enhances cell density and data capacity without relying on advances in process technology, and with minimal increase ... | |
 Researchers achieve atomic spectroscopy on a chip June 01, 2007 | User rating: 4.5 / 5 after 10 vote(s)
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Researchers at the University of California, Santa Cruz, have performed atomic spectroscopy with integrated optics on a chip for the first time, guiding a beam of light through a rubidium vapor cell integrated ... | |
Novel low temperature laser processing of silicon for hybrid organic/inorganic solar cells May 30, 2007 | User rating: 4.4 / 5 after 13 vote(s)
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Researchers at the Advanced Technology Institute (ATI) at the University of Surrey have reported a new technique to UV laser processing of thin film silicon for applications such as display control circuits and solar cells, ... | |
 IBM researchers demonstrate world's fastest optical chipset March 26, 2007 | User rating: 4.6 / 5 after 48 vote(s)
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At the 2007 Optical Fiber Conference, IBM scientists will reveal a prototype optical transceiver chipset capable of reaching speeds at least eight times faster than optical components available today. | |
 Samsung Begins World's First 60nm-DRAM Mass Production March 02, 2007 | User rating: 3.4 / 5 after 5 vote(s)
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Samsung Electronics announced today that it has begun mass producing the industry’s first 1Gigabit (Gb) DDR2 DRAM (dynamic random access memory) using 60 nanometer (nm)–class process technology. | |
 Samsung Says 3D Silicon Will Drive Boundless Industry Growth in Unprecedented Era of Fusion Technology December 13, 2006 | User rating: 3.3 / 5 after 33 vote(s)
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Samsung Electronics today shared stunning prospects for a new industry-fusing technology era that will offer tremendous global opportunities for expanded use of three-dimensional (3D) silicon-based technologies. ... | |
AMD and IBM Detail Early Results Using Immersion and Ultra Low-K in 45nm Chips December 13, 2006 | User rating: 3.7 / 5 after 11 vote(s)
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At the International Electron Device Meeting today, IBM and AMD presented papers describing the use of immersion lithography, ultra-low-K interconnect dielectrics, and multiple enhanced transistor strain techniques for application ... | |
 Trenches create memory space September 12, 2006 | User rating: 2.8 / 5 after 6 vote(s)
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The requirements are tightening up. Computers are having to become more and more efficient. A new technology boosts memory capacity: etching the silicon wafer creates deep trenches that increase its capacity ... | |
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