AMD and IBM Detail Early Results Using Immersion and Ultra Low-K in 45nm Chips December 13, 2006 | User rating: 3.7 / 5 after 11 vote(s)
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At the International Electron Device Meeting today, IBM and AMD presented papers describing the use of immersion lithography, ultra-low-K interconnect dielectrics, and multiple enhanced transistor strain techniques for application ... | |
 Trenches create memory space September 12, 2006 | User rating: 2.8 / 5 after 6 vote(s)
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The requirements are tightening up. Computers are having to become more and more efficient. A new technology boosts memory capacity: etching the silicon wafer creates deep trenches that increase its capacity ... | |
New record for world's fastest transistor set August 16, 2006 | User rating: 3.7 / 5 after 42 vote(s)
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Engineers in the School of Electronics and Computer Science (University of Southampton, UK) have developed a method to make bipolar transistors twice as fast as current devices. | |
Micron, Intel try out 50 nm NAND memory July 25, 2006 | User rating: 2.2 / 5 after 9 vote(s)
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Semiconductor giants Micron and Intel said Tuesday they were sampling the first NAND flash memory chips built on 50-nanometer processing technology. | |
 Glass fibers instead of copper cables July 24, 2006 | User rating: 3.3 / 5 after 47 vote(s)
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Semiconductor technology is expensive. Novel optical microchips made of plastic are set to bring down the price of fiber-optic technology in future. Personal fiber-optic connections for private individuals ... | |
HP Unveils Revolutionary Wireless Chip that Links the Digital and Physical Worlds July 17, 2006 | User rating: 3.3 / 5 after 26 vote(s)
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HP today announced that its researchers have developed a miniature wireless data chip that could provide broad access to digital content in the physical world. | |
 Panasonic Develops the World's First GaN Vertical Transistor June 28, 2006 | User rating: 3.7 / 5 after 12 vote(s)
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Panasonic today announced the development of a Gallium Nitride (GaN) transistor with vertical structure which dramatically reduces the chip size comparing with the conventional planar structure. This is the ... | |
Wireless World: Next-generation tracking June 16, 2006 | User rating: not shown ( 4 vote(s) ) | No comments yet
The second generation of wireless package tracking technology -- radio frequency identification (RFID) gear -- is emerging rapidly, changing the way manufacturers monitor shipments. | |
Circuit board materials may like it hot (or not) June 09, 2006 | User rating: 4.6 / 5 after 7 vote(s)
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Electrical circuits may act differently in Arizona than they do in Alaska--potentially affecting the performance of computers and other electronics. A new technique identifies and quantifies an important cause of this temperature ... | |
 Chipmakers shrug off economic worries June 08, 2006 | User rating: not rated yet | No comments yet
Oil prices continue to go up, and there is growing concern about inflation putting a damper on economic growth across the globe. Yet while it may be easy enough to be wary of global growth prospects, the electronics ... | |
Universal ink for microcontact printing June 01, 2006 | User rating: 4.8 / 5 after 10 vote(s)
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"Printing" on the micrometer scale is the technology of the future for the production of the electronic components used for such things as flat-screen monitors or (bio)sensors. | |
 Inexpensive Detector Sees the Invisible, In Color May 24, 2006 | User rating: 4.3 / 5 after 20 vote(s)
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An inexpensive detector developed by a NASA-led team can now see invisible infrared light in a range of "colors," or wavelengths. | |
Flash memory gets boost from x4 technology May 16, 2006 | User rating: 4.1 / 5 after 16 vote(s)
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Memory cards, USB ports and iPods are about to get smaller and cheaper to produce, according to a company that has just unveiled 4 bit per cell NAND flash technology. | |
First Details on a Future Intel Design Codenamed 'Larrabee' August 04, 2008 | User rating: 3.4 / 5 after 5 vote(s)
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Intel Corporation is presenting a paper at the SIGGRAPH 2008 industry conference in Los Angeles on Aug. 12 that describes features and capabilities of its first-ever forthcoming "many-core" blueprint or architecture codenamed ... | |
 IMEC reports major progress in EUV July 14, 2008 | User rating: not rated yet | User comments: 1
IMEC reports functional 0.186µm2 32nm SRAM cells made with FinFETs from which the contact layer was successfully printed using ASML’s full field extreme ultraviolet (EUV) Alpha Demo Tool (ADT). Applied Materials, ... | |
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