Intel, Samsung, TSMC Reach Agreement for 450mm Wafer Manufacturing Transition May 06, 2008 | User rating: 3.7 / 5 after 9 vote(s)
| User comments: 1
Intel Corp., Samsung Electronics and TSMC today announced they have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012. The transition to larger ... | |
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