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Technology / Semiconductors news 1234

Rensselaer student invents alternative to silicon chip

May 13, 2008 | User rating: 4.6 / 5 after 86 vote(s) | User comments: 13

Even before Weixiao Huang received his doctorate from Rensselaer Polytechnic Institute, his new transistor captured the attention of some of the biggest American and Japanese automobile companies. The 2008 ...


Intel, Samsung, TSMC Reach Agreement for 450mm Wafer Manufacturing Transition

May 06, 2008 | User rating: 3.4 / 5 after 10 vote(s) | User comments: 1

Intel Corp., Samsung Electronics and TSMC today announced they have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012. The transition to larger ...


Epson, E Ink Develop Breakthrough Controller IC for Electronic Paper Displays

April 16, 2008 | User rating: not shown ( 2 vote(s) ) | No comments yet

Seiko Epson and E Ink today announced a jointly developed display controller IC enabling new capabilities for E Ink's Vizplex enabled electronic paper displays. EPD low-power consumption screen technology ...


The future of computing -- carbon nanotubes and superconductors to replace the silicon chip

March 28, 2008 | User rating: 4.1 / 5 after 12 vote(s) | No comments yet

The future of computing is under the spotlight at the Institute of Physics’ Condensed Matter and Materials Physics conference at the Royal Holloway College of the University of London on 26-28 March.


Silent, microchip-sized 'fan' has no moving parts, yet produces enough wind to cool a laptop

March 18, 2008 | User rating: 4.5 / 5 after 109 vote(s) | User comments: 11

Engineers harnessing the same physical property that drives silent household air purifiers have created a miniaturized device that is now ready for testing as a silent, ultra-thin, low-power and low maintenance ...


IBM researchers unveil green optical network technology prototype

February 28, 2008 | User rating: 4.6 / 5 after 79 vote(s) | User comments: 1

IBM researchers today unveiled the fastest and most highly integrated optical data bus ever developed. The prototype technology could bring massive amounts of bandwidth in an energy-efficient way to all kinds ...


AMD, Partners Produce Test Chip Using EUV Lithography

February 26, 2008 | User rating: 4.3 / 5 after 21 vote(s) | User comments: 3

AMD, working together with its research partner, IBM, announced it has produced a working test chip utilizing Extreme Ultra-Violet (EUV) lithography for the critical first layer of metal connections across the entire chip. ...


IMEC obtains record conversion efficiency of 24.7% for GaAs solar cells on Ge substrate

February 25, 2008 | User rating: not shown ( 2 vote(s) ) | User comments: 1

IMEC has realized a single-junction GaAs solar cell on a Ge substrate with a record conversion efficiency of 24.7%. The efficiency was measured and confirmed by NREL (National Renewable Energy Laboratory, ...


NXP announces world's smallest high-performance MOSFET

February 25, 2008 | User rating: not shown ( 4 vote(s) ) | No comments yet

NXP Semiconductors, the independent company founded by Philips, today announced a new range of small signal MOSFET devices housed in one of the world’s smallest packages, the SOT883. Boasting an ultra-small 1.0 x 0.6 mm footprint, ...


Advanced engineered substrates boost chip performance

February 21, 2008 | User rating: not shown ( 2 vote(s) ) | No comments yet

A single platform that combines the benefits of strained silicon and silicon-on-insulator technologies hopes to offer much improved performance for future chip generations.


Breaking the performance barrier of 22-nm CMOS technology

February 19, 2008 | User rating: 4.5 / 5 after 23 vote(s) | User comments: 1

A major initiative has been launched in Europe with a top-ranked project called DUALLOGIC, Dual channel CMOS for (sub)-22 nm high performance logic.


SEMATECH Achieves Single Digit EUV Mask Blank Defect Goal

February 11, 2008 | User rating: not shown ( 1 vote(s) ) | User comments: 3

Technologists at SEMATECH have successfully demonstrated world-class results in low defect density for mask blanks used in extreme ultraviolet lithography (EUVL)—pushing the technology another significant step toward readiness ...


EPIC: Building the Perfect Chip

February 07, 2008 | User rating: 4.6 / 5 after 8 vote(s) | No comments yet

Three years ago a team from Bell Labs took on a very daunting challenge – put an optical networking system on a commercially manufactured silicon chip, load it with a smorgasbord of sophisticated opto-electronic devices in ...


Toshiba develops the world's fastest speed embedded DRAM technology

February 06, 2008 | User rating: not shown ( 3 vote(s) ) | No comments yet

Toshiba Corporation today announced that it has realized the world's fastest circuit technology for embedded DRAM for System LSI, achieving a speed of 833MHz at 32Mb density. The technology will be applied ...


SanDisk to Launch 43-Nanometer Multi-Level NAND Flash Memory in Mass Production

February 06, 2008 | User rating: 4.5 / 5 after 6 vote(s) | No comments yet

SanDisk Corporation today announced the introduction of Multi-Level (MLC) NAND flash memory using 43 nanometer process technology co-developed with Toshiba Corporation in Japan.


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