IDF, Day Two: Intel Talks Mobile Roadmaps, Next-Gen UMPC Platforms, and Silicon Scaling April 18, 2007 | User rating: not shown ( 4 vote(s) ) | No comments yet
During day two of the Intel Developer's Forum in Beijing, Intel executives are expected to discuss the company's future plans for mobile processors, including a next-generation UMPC platform based on a 45-nm, high-k low power ... | |
Intel Aims High at IDF April 17, 2007 | User rating: not shown ( 3 vote(s) ) | No comments yet
On the first day of the Intel Developer Forum, the company details several new products on its road map, including its 45-nm "Penryn" processors and its new System on a Chip technology. Intel is working to show that there ... | |
 Intel Outlines Latest vPro Platform March 17, 2007 | User rating: not shown ( 1 vote(s) ) | No comments yet
Intel, which is now gearing up to revamp the vPro platform, officially launched its business desktop platform in April and the technology began to ship to OEMs in September. | |
Micron, Intel try out 50 nm NAND memory July 25, 2006 | User rating: 2.2 / 5 after 9 vote(s)
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Semiconductor giants Micron and Intel said Tuesday they were sampling the first NAND flash memory chips built on 50-nanometer processing technology. | |
In Brief: Winbond buys laser system for chip plant July 07, 2006 | User rating: not shown ( 3 vote(s) ) | No comments yet
U.S. laser producer ESI has received an order from Winbond Electronics for a semiconductor link processing system to be used in Winbond's 300mm fab plant in Taiwan. | |
In Brief: WTO panel to examine Japan-Korea chip tiff June 21, 2006 | User rating: not rated yet | No comments yet
The World Trade Organization said this week it would seat a panel to look at the tariff dispute between South Korea and Japan involving DRAM memory chips. | |
China now official member of chip council June 16, 2006 | User rating: not rated yet | No comments yet
China officially took its place as a full member of the World Semiconductor Council this week at a ceremony held in Beijing. | |
Wireless World: Next-generation tracking June 16, 2006 | User rating: not shown ( 4 vote(s) ) | No comments yet
The second generation of wireless package tracking technology -- radio frequency identification (RFID) gear -- is emerging rapidly, changing the way manufacturers monitor shipments. | |
TI developes 45-nm chip production process June 12, 2006 | User rating: not shown ( 3 vote(s) ) | No comments yet
Texas Instruments said Monday it had developed a 45-nanometer wet lithography process that doubles the number of chips it can produce on a silicon wafer. | |
In Brief: Cup matches part of mobile TV field trials June 09, 2006 | User rating: not rated yet | No comments yet
A mobile television system developed by STMicroelectronics will undergo field trials in Germany during the World Cup soccer tournament that begins Friday. | |
 Chipmakers shrug off economic worries June 08, 2006 | User rating: not rated yet | No comments yet
Oil prices continue to go up, and there is growing concern about inflation putting a damper on economic growth across the globe. Yet while it may be easy enough to be wary of global growth prospects, the electronics ... | |
Boeing, FedEx trial plane-part RFIDs June 05, 2006 | User rating: not shown ( 1 vote(s) ) | No comments yet
Boeing and FedEx are testing the effectiveness of higher-powered RFID tags as a means of monitoring the condition of an MD-10 air freighter. | |
Qualcomm unveils versatile mobile TV chip May 26, 2006 | User rating: not shown ( 1 vote(s) ) | No comments yet
Qualcomm unveiled a new chip Friday that supports three major wireless television standards. | |
Flash memory gets boost from x4 technology May 16, 2006 | User rating: 4 / 5 after 15 vote(s)
| No comments yet
Memory cards, USB ports and iPods are about to get smaller and cheaper to produce, according to a company that has just unveiled 4 bit per cell NAND flash technology. | |
Japan falls behind in chip manufacturing May 16, 2006 | User rating: not shown ( 1 vote(s) ) | No comments yet
A university study suggests Japan is falling behind other nations in the production of Dynamic Random Access Memory (DRAM) chips for personal computers. | |
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